High Temperature, manufactured by Formlabs Ltd., is a resin based material compatible with desktop Stereolithography (SLA) technology. One of the highlights of this material is its high Heat Deflection Temperature (HDT) of 289˚C @ 0.45 MPa, which is incomparable with any other 3D Printing material currently available in the market.
The material has a light-yellowish color and has an inherent smooth surface finish despite support structure generation. The material is best suited for applications experiencing high temperatures with minimal loading. The material is NOT flexible, thereby it is unsuitable for applications requiring snap fits and live hinges.
With Post-Processing: + (1-2) business days depending on the post-processing options chosen
- High Heat deflection temperature
- Good mechanical properties
- Smooth surface finish
- Unsuitable for Snap-fits and live-hinges
- Support structure generation
- High temperature applications
- Electronic enclosures
- 3D Printed Molds with desktop injection molding
- Automotive, packaging industries
High temperature is a resin based material having high Heat Deflection Temperature (HDT) of 289˚C @ 0.45 MPa. It is used in electronic enclosures and applications subjected to high temperatures with minimal loading
High Temperature Design Guidelines
- For a given part geometry, the minimum wall thickness should be at least 1mm.
- For rigid wall: 1.5 mm
Minimum detail size
- The minimum supported feature thickness: At least 0.8 mm
- Since High Temperature parts are fabricated in desktop Stereolithography (SLA) technology, support structures are generated on part geometries with overhangs and unsupported features.
Embossing and Engraving:
- Recommended fonts for a clear, legible text: Arial, Gothic.
- Letter strand width: at least 0.6mm
- Embossing height: at least 0.5mm
- Engraving (cavity) depth: at least 0.5mm
- If the length of the wall is greater than 50mm (5 cm), then a minimum wall thickness of 2mm should be kept to impart decent strength.